- wafer thickness
- wafer thickness Waferdicke f
English-German dictionary of Electrical Engineering and Electronics. 2013.
wafer thickness
Schlagen Sie auch in anderen Wörterbüchern nach:
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer — Als Wafer [ˈweɪfə(r)] (engl. „Waffel“ oder „Oblate“) werden in der Mikroelektronik, Photovoltaik und Mikrosystemtechnik kreisrunde oder quadratische, ca. 1 mm dicke Scheiben bezeichnet. Sie werden aus ein oder polykristallinen (Halbleiter… … Deutsch Wikipedia
Microelectromechanical systems — (MEMS) (also written as micro electro mechanical, MicroElectroMechanical or microelectronic and microelectromechanical systems) is the technology of very small mechanical devices driven by electricity; it merges at the nano scale into… … Wikipedia
Surface photovoltage — (SPV) measurements are a widely used method to determine the minority carrier diffusion length of semiconductors. Since the transport of minority carriers determines the behavior of the p n junctions that are ubiquitous in semiconductor devices,… … Wikipedia
DelSolar — Co., Ltd. Type Public (Emerging stock) (GTSM: 3599) Industry Solar cell, solar module, and Photovoltaic system … Wikipedia
Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of … Wikipedia
materials science — the study of the characteristics and uses of various materials, as glass, plastics, and metals. [1960 65] * * * Study of the properties of solid materials and how those properties are determined by the material s composition and structure, both… … Universalium
Thermal oxidation — In microfabrication, thermal oxidation is a way to produce a thin layer of oxide (usually silicon dioxide) on the surface of a wafer (semiconductor). The technique forces an oxidizing agent to diffuse into the wafer at high temperature and react… … Wikipedia
Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 … Wikipedia
MOSFET — Two power MOSFETs in the surface mount package D2PAK. Operating as switches, each of these components can sustain a blocking voltage of 120 volts in the OFF state, and can conduct a continuous current of 30 amperes in the ON state, dissipating up … Wikipedia
Laser diode — Top: a packaged laser diode shown with a penny for scale. Bottom: the laser diode chip is removed from the above package and placed on the eye of a needle for scale … Wikipedia
